SERVICE AREA
SERVICE AREA
Special Gas Pipeline System

SiH4, NF3, Cl2 are flammable and explosive gases, toxic gases, corrosive gases, and highly hazardous gases with purity exceeding 99.999% that require safety in the storage, transportation, and distribution processes of special gases. Special gas system engineering is an engineering project used to ensure the safe use of special gas systems. Gesparker provides comprehensive solutions including design, selection, manufacturing, installation, testing, debugging, and system hosting services.

The special gas pipeline system consists of four types of equipment: storage, transportation, distribution, and control. Among them, "storage" refers to the gas source part (special gas cabinet GC), "transportation" refers to the piping part (usually using double sleeves), "distribution" refers to the secondary distribution part (gas distribution cabinet VMB), and "control" refers to the supervision and control part (gas management system GMS).

Types of special gas control systems:

●Semi automatic GC/GR              ●Fully automatic GC/GR  

●Fully automatic VMB                  ●Bulk Special Gas System (BSGS)

●High precision mixing system    ●TTMA supply system

●TEOS supply system                   ●DEZ supply system

●TCS/DCS supply system             ●Non standard customized special gas system

Characteristics of special gas pipeline system:
Characteristics of special gas pipeline system:

1.Each device in the special gas system is equipped with PLC control, color touch screen operation, temperature, pressure, smoke, leakage monitoring and alarm, and can expand earthquake monitoring and alarm; A single device can operate independently as a standalone system, or multiple devices can be connected by PLC or TGO to form a large system, which can be centrally monitored and managed in the monitoring center. Its alarm system can also be integrated with the safety supervision system and fire protection system. 

2.Electronic specialty gases are essential foundational support source materials for fields such as optoelectronics and microelectronics, particularly for ultra large scale integrated circuits, liquid crystal display devices, amorphous silicon thin-film solar cells, semiconductor light-emitting devices, and semiconductor material manufacturing processes. Its purity and cleanliness directly affect the quality, integration, specific technical indicators, and yield of optoelectronic and microelectronic components, and fundamentally constrain the accuracy and precision of circuits and devices.


Suitable occasions:
Suitable occasions:

Semiconductor chips, microelectronics companies, photovoltaic solar energy, biopharmaceuticals, new materials and other industries are often equipped with equipment for sputtering vacuum plating, deposition etching, passivation cleaning, etc

Design specifications and references
  • GB/T20801-2006
    《Pressure Piping Code - Industrial Piping》
  • GB9448-1999
    《Safety in Welding and Cutting》
  • GB4962-2008
    《Safety Technical Specifications for Hydrogen Use》